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Communications of the ACM.

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TextSeries: ; Communications of the ACM, Vol. 56, No. 11, November 2013Publication details: New York : Association for Computing Machinery (ACM), c2013Description: 120 pages : color illustrations ; 28 cmISSN: 0001-0782Subject(s): COMPUTER SCIENCE EDUCATION | SOFTWARE ARCHITECTURES | COMPUTING EDUCATION | SEMICONDUCTOR MEMORY | INTELLECTUAL PROPERTY | COMPUTER CRIME

Contents:

The end of the American network -- Heidelberg Laureate Forum -- Microprocessor architectures follow markets and silicon -- Considering privacy issues in the context of Google glass -- Future-proof encryption -- More than a mouse -- Legal issues with robots -- What regulators can do to advance privacy through design -- Is software patentable? -- No limits to watching? -- Why not immortality? -- Making computer science count -- Augmented reality browsers: essential products or only gadgets? -- Adopting DevOps practices in quality assurance -- Leaking space -- Agile and SEMAT: perfect partners -- Computing technologies for reflective, creative care of people with dementia -- Media tablets for mobile learning -- Algorithmic trading review -- Adaptation of audiovisual contents and their delivery means -- Centip3De demonstrates more than Moore…: technical perspective -- Centip3De demonstrates more than Moore…: technical perspective -- Centip3De: a many-core prototype exploring 3D integration and near-threshold computing -- Puzzled: Coin flipping.

Summary: [Article Title: The end of the American network / Moshe Y. Vardi, p.5] Abstract: Can the Internet be liberated from government meddling? https://doi.org/10.1145/2524713.2524714Summary: [Article Title: Heidelberg Laureate Forum / Vinton G. Cerf, p.7] https://doi.org/10.1145/2524713.2524715Summary: [Article Title: Microprocessor architectures follow markets and silicon / CACM Staff, p.8-9] https://doi.org/10.1145/2524713.2524716Summary: [Article Title: Considering privacy issues in the context of Google glass / Jason Hong, p.10-11] Abstract: The Communications Web site, http://cacm.acm.org, features more than a dozen bloggers in the BLOG@CACM community. In each issue of Communications, we'll publish selected posts or excerpts. https://doi.org/10.1145/2524713.2524717Summary: [Article Title: Future-proof encryption / Gregory Mone, p.12-14] Abstract: Researchers are relying on quantum mechanics to generate unhackable methods of communication. https://doi.org/10.1145/2524713.2524718Summary: [Article Title: More than a mouse / Neil Savage, p.15-16] Abstract: Gesture and gaze are among the newest additions to a growing family of computer interfaces. https://doi.org/10.1145/2524713.2524719Summary: [Article Title: Legal issues with robots / Keith Kirkpatrick, p.217-19] Abstract: Who is responsible when property is damaged or someone is injured by an automated system? Existing product liability laws have not yet been tested in the context of robots. https://doi.org/10.1145/2524713.2524720Summary: [Article Title: What regulators can do to advance privacy through design / Deirdre K. Mulligan and Kenneth A. Bamberger, p.20-22] Abstract: Seeking to address the challenges of privacy by design through regulatory process and formal law. https://doi.org/10.1145/2527185Summary: [Article Title: Is software patentable? / Pamela Samuelson, p.23-25] Abstract: Assessing the shifting perspectives on patentability standards for software. https://doi.org/10.1145/2527186Summary: [Article Title: No limits to watching? / Katina Michael and MG Michael, p.26-28] Abstract: Considering the ethical questions raised by technologies that are moving from knowing what we are doing (and where) to knowing who we are. https://doi.org/10.1145/2527187Summary: [Article Title: Why not immortality? / Marshall Van Alstyne, p.29-31] Abstract: A question of biology, technology, and society https://doi.org/10.1145/2527188Summary: [Article Title: Making computer science count / Cameron Wilson, p.32-33] Abstract: Combining efforts and expertise, ACM and Code.org are partnering to address a rapidly changing education landscape. https://doi.org/10.1145/2527189Summary: [Article Title: Augmented reality bro4-36] Abstract: https://doi.org/10.1145/2527190Summary: [Article Title: Adopting DevOps practices in quality assurance / James Roche, p.38-43] Abstract: Merging the art and science of software development. https://doi.org/10.1145/2524713.2524721Summary: [Article Title: Leaking space / Neil Mitchell, p.44-52 Abstract: Eliminating memory hogs. https://doi.org/10.1145/2524713.2524722Summary: [Article Title: Agile and SEMAT: perfect partners / Ivar Jacobson, Ian Spence, and Pan-Wei Ng, p.53-59] Abstract: Combining agile and SEMAT yields more advantages than either one alone. https://doi.org/10.1145/2524713.2524723Summary: [Article Title: Computing technologies for reflective, creative care of people with dementia / FNeil Maiden, Sonali D'Souza, Sara Jones, Lars Müller, Lucia Pannese, Kristine Pitts, Michael Prilla, Kevin Pudney, Malcolm Rose, Ian Turner, and Konstantinos Zachos, p.60-67] Abstract: Mobile apps manage data on individual residents to help carers deliver more person-centered care. https://doi.org/10.1145/2500495Summary: [Article Title: Media tablets for mobile learning / Evgeny Kaganer, Gabriel A. Giordano, Sebastien Brion, and Marco Tortoriello, p.68-75] Abstract: Tablets offer hope for improving learning and collaboration but only if truly integrated into learning settings. https://doi.org/10.1145/2500494Summary: [Article Title: Algorithmic trading review / Philip Treleaven, Michal Galas, and Vidhi Lalchand, p76-85] Abstract: The competitive nature of AT, the scarcity of expertise, and the vast profits potential, makes for a secretive community where implementation details are difficult to find. https://doi.org/10.1145/2500117Summary: [Article Title: Adaptation of audiovisual contents and their delivery means / Mamadou Tourad Diallo, Hassnaa Moustafa, Hossam Afifi, and Nicolas Marechal, p.86-93] Abstract: Coupling content adaptation with context awareness is a promising approach for improving the user's experience. https://doi.org/10.1145/2500726Summary: [Article Title: Centip3De demonstrates more than Moore…: technical perspective / Shekhar Borkar, p.96] https://doi.org/10.1145/2524713.2524724Summary: [Article Title: Centip3De: a many-core prototype exploring 3D integration and near-threshold computing / Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory Chen, Dennis Sylvester, David Blaauw, and Trevor Mudge, p.97-104] Abstract: Process scaling has resulted in an exponential increase of the number of transistors available to designers. Meanwhile, global interconnect has not scaled nearly as well, because global wires scale only in one dimension instead of two, resulting in fewer, high-resistance routing tracks. This paper evaluates the use of three-dimensional (3D) integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias (TSVs). Because global interconnect can be millimeters long, and silicon layers tend to be only tens of microns thick in 3D stacked processes, the power and performance gains by using vertical interconnect can be substantial. To address the thermal issues that arise with 3D integration, this paper also evaluates the use of near-threshold computing---operating the system at a supply voltage just above the threshold voltage of the transistors. Specifically, we will discuss the design and test of Centip3De, a large-scale 3D-stacked near-threshold chip multiprocessor. Centip3De uses Tezzaron's 3D stacking technology in conjunction with Global Foundries' 130 nm process. https://doi.org/10.1145/2524713.2524725Summary: [Article Title: Puzzled: Coin flipping / Peter Winkler, p.120] Abstract: Each of these puzzles involves coin flipping. Simple stuff, right? Not necessarily…though solutions will indeed be provided in next month's column. https://doi.org/10.1145/2524713.2524726

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Item type	Current library	Home library	Collection	Shelving location	Call number	Copy number	Status	Date due	Barcode
Serials	LRC - Main	National University - Manila	Gen. Ed. - CCIT	Periodicals	Communications of the ACM, Vol. 56, No. 11, November 2013 (Browse shelf (Opens below))	c.1	Available		PER000000930

Includes bibliographical references.

[Article Title: The end of the American network / Moshe Y. Vardi, p.5]

Abstract: Can the Internet be liberated from government meddling?

https://doi.org/10.1145/2524713.2524714

[Article Title: Heidelberg Laureate Forum / Vinton G. Cerf, p.7]

https://doi.org/10.1145/2524713.2524715

[Article Title: Microprocessor architectures follow markets and silicon / CACM Staff, p.8-9]

https://doi.org/10.1145/2524713.2524716

[Article Title: Considering privacy issues in the context of Google glass / Jason Hong, p.10-11]

Abstract: The Communications Web site, http://cacm.acm.org, features more than a dozen bloggers in the BLOG@CACM community. In each issue of Communications, we'll publish selected posts or excerpts.

https://doi.org/10.1145/2524713.2524717

[Article Title: Future-proof encryption / Gregory Mone, p.12-14]

Abstract: Researchers are relying on quantum mechanics to generate unhackable methods of communication.

https://doi.org/10.1145/2524713.2524718

[Article Title: More than a mouse / Neil Savage, p.15-16]

Abstract: Gesture and gaze are among the newest additions to a growing family of computer interfaces.

https://doi.org/10.1145/2524713.2524719

[Article Title: Legal issues with robots / Keith Kirkpatrick, p.217-19]

Abstract: Who is responsible when property is damaged or someone is injured by an automated system? Existing product liability laws have not yet been tested in the context of robots.

https://doi.org/10.1145/2524713.2524720

[Article Title: What regulators can do to advance privacy through design / Deirdre K. Mulligan and Kenneth A. Bamberger, p.20-22]

Abstract: Seeking to address the challenges of privacy by design through regulatory process and formal law.

https://doi.org/10.1145/2527185

[Article Title: Is software patentable? / Pamela Samuelson, p.23-25]

Abstract: Assessing the shifting perspectives on patentability standards for software.

https://doi.org/10.1145/2527186

[Article Title: No limits to watching? / Katina Michael and MG Michael, p.26-28]

Abstract: Considering the ethical questions raised by technologies that are moving from knowing what we are doing (and where) to knowing who we are.

https://doi.org/10.1145/2527187

[Article Title: Why not immortality? / Marshall Van Alstyne, p.29-31]

Abstract: A question of biology, technology, and society

https://doi.org/10.1145/2527188

[Article Title: Making computer science count / Cameron Wilson, p.32-33]

Abstract: Combining efforts and expertise, ACM and Code.org are partnering to address a rapidly changing education landscape.

https://doi.org/10.1145/2527189

[Article Title: Augmented reality bro4-36]

Abstract:

https://doi.org/10.1145/2527190

[Article Title: Adopting DevOps practices in quality assurance / James Roche, p.38-43]

Abstract: Merging the art and science of software development.

https://doi.org/10.1145/2524713.2524721

[Article Title: Leaking space / Neil Mitchell, p.44-52

Abstract: Eliminating memory hogs.

https://doi.org/10.1145/2524713.2524722

[Article Title: Agile and SEMAT: perfect partners / Ivar Jacobson, Ian Spence, and Pan-Wei Ng, p.53-59]

Abstract: Combining agile and SEMAT yields more advantages than either one alone.

https://doi.org/10.1145/2524713.2524723

[Article Title: Computing technologies for reflective, creative care of people with dementia / FNeil Maiden, Sonali D'Souza, Sara Jones, Lars Müller, Lucia Pannese, Kristine Pitts, Michael Prilla, Kevin Pudney, Malcolm Rose, Ian Turner, and Konstantinos Zachos, p.60-67]

Abstract: Mobile apps manage data on individual residents to help carers deliver more person-centered care.

https://doi.org/10.1145/2500495

[Article Title: Media tablets for mobile learning / Evgeny Kaganer, Gabriel A. Giordano, Sebastien Brion, and Marco Tortoriello, p.68-75]

Abstract: Tablets offer hope for improving learning and collaboration but only if truly integrated into learning settings.

https://doi.org/10.1145/2500494

[Article Title: Algorithmic trading review / Philip Treleaven, Michal Galas, and Vidhi Lalchand, p76-85]

Abstract: The competitive nature of AT, the scarcity of expertise, and the vast profits potential, makes for a secretive community where implementation details are difficult to find.

https://doi.org/10.1145/2500117

[Article Title: Adaptation of audiovisual contents and their delivery means / Mamadou Tourad Diallo, Hassnaa Moustafa, Hossam Afifi, and Nicolas Marechal, p.86-93]

Abstract: Coupling content adaptation with context awareness is a promising approach for improving the user's experience.

https://doi.org/10.1145/2500726

[Article Title: Centip3De demonstrates more than Moore…: technical perspective / Shekhar Borkar, p.96]

https://doi.org/10.1145/2524713.2524724

[Article Title: Centip3De: a many-core prototype exploring 3D integration and near-threshold computing / Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory Chen, Dennis Sylvester, David Blaauw, and Trevor Mudge, p.97-104]

Abstract: Process scaling has resulted in an exponential increase of the number of transistors available to designers. Meanwhile, global interconnect has not scaled nearly as well, because global wires scale only in one dimension instead of two, resulting in fewer, high-resistance routing tracks. This paper evaluates the use of three-dimensional (3D) integration to reduce global interconnect by adding multiple layers of silicon with vertical connections between them using through-silicon vias (TSVs). Because global interconnect can be millimeters long, and silicon layers tend to be only tens of microns thick in 3D stacked processes, the power and performance gains by using vertical interconnect can be substantial. To address the thermal issues that arise with 3D integration, this paper also evaluates the use of near-threshold computing---operating the system at a supply voltage just above the threshold voltage of the transistors.

Specifically, we will discuss the design and test of Centip3De, a large-scale 3D-stacked near-threshold chip multiprocessor. Centip3De uses Tezzaron's 3D stacking technology in conjunction with Global Foundries' 130 nm process.

https://doi.org/10.1145/2524713.2524725

[Article Title: Puzzled: Coin flipping / Peter Winkler, p.120]

Abstract: Each of these puzzles involves coin flipping. Simple stuff, right? Not necessarily…though solutions will indeed be provided in next month's column.

https://doi.org/10.1145/2524713.2524726

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